- Series :
- Applications :
- Factory Stock :
85 產品
| 圖片 | 型號 | 價格 | 數量 | 庫存 | 製造商 | 描述 | Package / Case | Series | Packaging | Mounting Type | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Applications | Current - Supply | Factory Stock | Minimum Quantity | |
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查看 | NXP USA Inc. | REGULATOR BUCK QUAD WITH UP TO | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | 4000 | |||
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查看 | NXP USA Inc. | REGULATOR BUCK QUAD WITH UP TO | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | 4000 | |||
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查看 | NXP USA Inc. | REGULATOR BUCK QUAD WITH UP TO | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | 4000 | |||
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查看 | NXP USA Inc. | REGULATOR BUCK QUAD WITH UP TO | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | 4000 | |||
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查看 | NXP USA Inc. | REGULATOR BUCK QUAD WITH UP TO | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | 4000 | |||
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查看 | NXP USA Inc. | IC REG 9OUT BUCK/LDO 56QFN | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | 4000 | |||
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查看 | NXP USA Inc. | IC REG 9OUT BUCK/LDO 56QFN | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | 4000 | |||
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查看 | NXP USA Inc. | IC REG 9OUT BUCK/LDO 56QFN | 56-VFQFN Exposed Pad | Automotive, AEC-Q100 | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 56-QFN-EP (8x8) | QorlQ LS1/T1 Communications Processors | 250µA | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 48-QFN (7x7) | LS1 Communication Processors | 450µA | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 48-QFN (7x7) | LS1 Communication Processors | 450µA | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 105°C (TA) | Active | 2.8 V ~ 4.5 V | 48-QFN (7x7) | LS1 Communication Processors | 450µA | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 | |||
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查看 | NXP USA Inc. | POWER MANAGEMENT IC I.MX7 PRE- | 48-VFQFN Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 85°C | Active | 2.8 V ~ 5.5 V | 48-QFN (7x7) | i.MX Processors | - | 0 | 4000 |
