- Packaging :
- Operating Temperature :
132 產品
| 圖片 | 型號 | 價格 | 數量 | 庫存 | 製造商 | 描述 | Package / Case | Series | Packaging | Mounting Type | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Applications | Factory Stock | Minimum Quantity | |
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查看 | NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | FS4500 | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | FS4500 | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP LINEAR 0.5A V | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | FS4500 | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP LINEAR 0.5A V | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | FS6500 | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 150°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 2000 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 0.8A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 1.5A VCO | 48-LQFP Exposed Pad | - | Tray | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 250 | |||
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查看 | NXP USA Inc. | SYSTEM BASIS CHIP DCDC 2.2A VCO | 48-LQFP Exposed Pad | - | Tape & Reel (TR) | Surface Mount | -40°C ~ 125°C (TA) | Active | -1.0 V ~ 40 V | 48-LQFP (7x7) | System Basis Chip | 0 | 2000 |
