- Insulation Material :
3 產品
| 圖片 | 型號 | 價格 | 數量 | 庫存 | 製造商 | 描述 | Series | Packaging | Current Rating | Number of Positions | Number of Rows | Contact Material | Row Spacing | Connector Type | Mounting Type | Contact Type | Features | Style | Termination | Insulation Material | Description | |
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查看 | Molex, LLC | CONN HEADER 8POS 3MM RT ANG TIN | Micro-Fit 3.0 BMI 44428 | Tray | - | All | 2 | Brass | 0.118" (3.00mm) | Header | Through Hole, Right Angle | Male Pin | Board Lock | Board to Board or Cable | Solder | Polyamide (PA), Nylon, Glass Filled | CONN HEADER 8POS 3MM RT ANG TIN | |||
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獲得報價 |
2,311
有現貨
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Molex, LLC | CONN HEADER 8POS 3MM RT ANG TIN | Micro-Fit 3.0 43650 | Tray | - | All | 1 | Brass | - | Header | Through Hole, Right Angle | Male Pin | Board Lock | Board to Cable/Wire | Solder | Liquid Crystal Polymer (LCP), Glass Filled | CONN HEADER 8POS 3MM RT ANG TIN | ||
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獲得報價 |
6,771
有現貨
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Molex, LLC | CONN HEADER 8POS 3MM RT ANG TIN | Micro-Fit 3.0 43045 | Tray | - | All | 2 | Brass | 0.118" (3.00mm) | Header | Through Hole, Right Angle | Male Pin | Board Lock | Board to Cable/Wire | Solder | Liquid Crystal Polymer (LCP), Glass Filled | CONN HEADER 8POS 3MM RT ANG TIN |
